Thursday, March 31, 2011
Sidense 1T-OTP Memory Available in ON Semiconductor 180 nm Process Technology
ON Semiconductor to develop Application Specific Integrated Circuits and Standards
Ottawa, Canada and PHOENIX, Arizona - March 31, 2011 - Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) one-time programmable (OTP) memory IP cores, and ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, have announced that Sidense has ported its 180 nanometer (nm) OTP memory SLP product line to ONC18, ON Semiconductor’s 180 nm digital and mixed-signal technology platform.
This licensing agreement will make SLP macros available for use in ON Semiconductor's Application Specific Standard Products (ASSPs) and for those customers who wish to include OTP IP in ASIC products fabricated by ON Semiconductor. In addition, Sidense will now be able to support its customers who want to use SLP macros and ON Semiconductor's foundry services. Single SLP macro densities ranging up to 256 kilobits (Kbits) will be available.
"With Sidense's secure and reliable OTP macros embedded in our products, ON Semiconductor has an added advantage over our competitors in supplying our customers with leading-edge silicon products covering a wide range of applications," said Bob Klosterboer, ON Semiconductor senior vice president of the Digital and Mixed Signal Product Group. "We chose Sidense's OTP intellectual property for its low power and small area and also because it doesn't require any changes or additions to our standard process flow."
SLP is a smaller, lower power version of Sidense's SiPROM product family with a maximum macro size of 256 Kbits. Initially manufactured at 180nm, SLP macros target cost- and power-sensitive applications such as handheld communication devices, chip and product IDs, analog trimming and calibration, and code storage.
About Sidense Corp.
Sidense Corp. provides secure, very dense and reliable non-volatile, one-time programmable (OTP) memory IP for use in standard-logic CMOS processes with no additional masks or process steps required and no impact on product yield. The Company's innovative one-transistor 1T-Fuse™ architecture provides the industry's smallest footprint, most reliable and lowest power Logic Non-Volatile Memory (NVM) IP solution. With over 70 patents granted or pending, Sidense OTP provides a field-programmable alternative solution to Flash, mask ROM and eFuse in many OTP and MTP applications.
Sidense SiPROM, SLP and ULP memory products, embedded in over 150 customer designs, are available from 180nm down to 40nm and are scalable to 28nm and below. The IP is offered at, and has been adopted by, all top-tier semiconductor foundries and selected IDMs. Customers are using Sidense OTP for analog trimming, code storage, encryption keys such as HDCP, WHDI, RFID and Chip ID, medical, automotive, and configurable processors and logic. For more information, please visit www.sidense.com.
About ON Semiconductor
ON Semiconductor (Nasdaq: ONNN) is a premier supplier of high performance silicon solutions for energy efficient electronics. The company's broad portfolio of power and signal management, logic, discrete and custom devices helps customers efficiently solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor operates a world-class, value-added supply chain and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit www.onsemi.com.
ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein.
CAIN COMMUNICATIONS FOR SIDENSE