Friday, May 02, 2008
Icera Launches Espresso® 300 Mobile Broadband Device Platform with Programmable Feature Set
Bristol, UK, 2 May 2008. Icera Inc., the leader in software defined wireless modem chipsets, has today announced the Espresso® 300 software defined, mobile broadband device platform. Espresso® 300 delivers a complete reference design for high performance mobile broadband devices such as USB dongles and embedded PCI minicard modules for laptops and mobile internet devices. Industry analysts expect the mobile broadband device market to grow from 90 million subscribers in 2007 to 1.3 billion by 2012.
Based on Icera's Livanto® ICE8040 chipset, Espresso® 300 includes hardware, PCB layout, firmware, drivers, host software support, Software Design Kit (SDK), manufacturing test and calibration tools, complete validation and certification including Global Certification Forum (GCF) and Network Vendor Inter-Operability Test (IOT) as well as pre-approvals for major cellular carrier networks.
The Espresso® 300 platform is unique in offering a software defined feature set that allows three different performance level products to be produced by device manufacturers. Based on the Icera Livanto® ICE8040 chipset, the platform can be configured with three different Icera Adaptive WirelessTM firmware solutions to support different feature sets and performance levels all from a common platform.
The three Adaptive WirelessTM soft modems supported on the Espresso® 300 platform are:
Adaptive Wireless HSPA-ADVANCED
Adaptive Wireless HSPA-STANDARD
Adaptive Wireless HSPA-LITE
In addition the Espresso® 300 platform is delivered with Adaptive Wireless VOICE to deliver a high performance slim-modem for the fast growing class of HSPA Smartphone devices. The Adaptive Wireless VOICE firmware module includes all major cellular voice codecs, advanced support for acoustic echo cancellation and noise suppression as well as adding drivers and integration software for leading cellular applications processors.
This unique software defined performance and feature set allows device manufactures to support a range of products leveraging a common development effort and platform. Board area and power consumption are class leading and allow smaller, neater HSPA Smartphone devices to be produced.
The Espresso® 300 platform is shipping to customers today.
For further information, please contact: